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Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7 pictures & photos
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
  • Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering Sn99cu0.7
state: Liquid
pH: Neutral
Type: Solder Paste
Melting Point: 200℃-300℃
Chemical Composition: Sn
Function: Make the Liquid Solder Flow
Samples:
US$ 20/Piece 1 Piece(Min.Order)
| Request Sample
100g
Customization:

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