No 3 4 LED SMT Relief Reballing Solder Tin Paste for Pcbs AG2sn62pb36

• Customization: Available
• state: Solid
• pH: Neutral
• Model NO.: Tin Paste
• Type: Solder Paste
• Melting Point: <200℃
• Chemical Composition: Sn-Pb
• Function: Make the Liquid Solder Flow
• Application: SMT
• Manufacturing Method: Smelting
• Alloy: Tin Lead
• Powder Size: Type 3: 25 to 45 Microns
• Powder Size 2: Type 4: 20 to 38 Microns
• Flux: No Clean Flux
• Alloy 2: Sn63pb37
• Alloy 3: Sn60pb40
• Alloy 4: Sn55pb45
• Alloy 5: Sn50pb50
• Packing: Jar
• Packing 2: Syringe
• Shipping: Courier / Air Freight
• Shelf Life: 6months
• Storage: 0 to 10 Degree Celsius
• Application 2: for SMD SMT Component Reflow Soldering
• Application 3: for LED SMT Soldering
• Transport Package: Foam Box
• Specification: 100g to 1000g
• Trademark: XF Solder
• Origin: China
• HS Code: 3810100000
• Production Capacity: 30tons/Month
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg
• Lead Time: 10 days (1 - 30 kg) ; To be negotiated ( > 30 kg)

Product Description

No 3 4 LED SMT Relief Reballing Solder Tin Paste For PCBs
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Tin Lead Solder Paste 63/37 Sn63Pb37

Tin Lead Solder Paste 63/37, also written as solder paste Sn63Pb37. It's a paste that is mixed with a no clean flux with tin lead alloy powder 63/37. 

Basic information of Tin Lead Solder Paste 63/37 Sn63Pb37:

Composition: Sn63Pb37, with 63% of tin & 37% of lead.
Powder size: Type 3, 25 to 45 microns. Other powder sizes are available upon requirement.
Flux: No clean type (about 11.5%)
Melting Point: 183ºC
Packing: Jar or Syringe.
Weight: 200g/jar, 500g/jar, 1000g/jar, 2000g/jar or other weight as per customers' requirements.
Color & Appearance of Paste: Metallic grey paste form.


Solder paste 63/37 is mainly used for SMT (surface mount technology) of PCB assembly, BGA etc. It's extremely suitable for assembly of small IC or soldering projects that manual soldering by solder wire or wave soldering by solder bar can't achieve. Tin lead solder paste Sn63Pb37 can be soldered either through hot air gun manual soldering or reflow oven.

 

Feature of Tin Lead Solder Paste 63/37 Sn63Pb37: 

1. Good wetting property. Solder paste 63/37 is easy to melt & wet fast.
2. No clean. The residue of tin lead solder paste Sn63Pb37 after soldering is non corrosive and transparent, in most general applications there is no need to do cleaning.
3. Stable viscosity during the continuous printing process. 
4. Bright & firm solder joints after soldering. 

Using & Storage of Tin Lead Solder Paste 63/37 Sn63Pb37:

1. Recommended storage of tin lead solder paste 63/37: kept in refrigerator at temperature between 0 to 10ºC.
2. Solder paste Sn63Pb37 must be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment.
3. We recommend using out the solder paste 63/37 after the jar is open each time. Mix the paste for at least one minute after fresh jar is open. In case there's still leftover paste after soldering, it must be tightly sealed and refrigerated when not in use. Before re-using, it's a must to double check if the solder pastes hasn't become separated or thicken to its usual state.
4. Read and follow TDS of solder paste Sn63Pb37 before using.