Sn99.3cu0.7 Sac07 Sacx07 Lead Free Solder Bar for Solder Pot DIP Soldering

• Type: Lead Free Solder Bar
• Material: Tin Silver Copper
• Diameter: 2.0mm
• Length: 200-300mm
• Welding Core Type: Carbon Structural Steel
• Electrode Coating Type: Titanium
• Model NO.: Lead Free Solder Bar
• Slag Characteristic: Alkaline
• Stainless Steel Welding Rod Type: Chromium Stainless Steel
• Function: Surfacing Electrode, Low Hydrogen Type Electrode, Hardfacing Electrode, High Efficient Iron Powder Electrode, Gravity Electrode, Moisture-Proof Electrode
• Alloy 1: Sac305 Sn96.5AG3.0cu0.5
• Alloy 2: Sacx0307 Sn99AG0.3cu0.7
• Alloy 3: Sacx07 Sn99.3cu0.7
• Base Metal: Tin, Silver, Copper
• Type of Solder: Lead Free Solder Bar
• Certificate: RoHS
• Color: Bright Silvery
• Weight Per Roll: Around 400g Per Solder Bar
• Inner Packing: Carton
• Outer Packing: Pallet
• Application 1: Wave Soldering
• Application 2: DIP Soldering
• Application 3: Wipe Soldering
• Flux: External Flux Is Needed
• OEM: Available
• Transport Package: Carton
• Specification: 3.15cm * 1.5cm * 1.0cm
• Trademark: XF SOLDER
• Origin: Shunde, Foshan, China
• HS Code: 831130000
• Production Capacity: 10800t/Year

Product Description

Sn99.3cu0.7 Sac07 Sacx07 Lead Free Solder Bar for Solder Pot Dip Soldering
Sn99.3Cu0.7 SAC07 SACX07 Lead Free Solder Bar:

Our company provides Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice. 


Applications of Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307:
Solder Bar SAC0307 is used for assembly of electronics components which requires RoHS compliant. Commonly the IC components are insert into the PCB and then we use the molten solder bar to assemble them by dip soldering or wave soldering. We call this process the THT (through holes technology).

We also use this solder bar for tinning electrical wires or pins of IC components, for enhancing the electrical conductivity and get them to be easier for further assembly.

How to use Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307?
Method 1: by dip soldering:
Use solder pots to melt the solder bar SAC0307 and get the solder remains at the correct temperature. And them put the assembled PCB board (THT) to go through flux pot to get tbe bottom side of the board well dipped with wet flux. Then move the PCB board to the solder pot and let the bottom side of PCB board well touched with the molten solder. With the help of the flux, the solder will cover the pins and pad evenly.

Method 2: by wave soldering:
We will need the professional wave soldering machine to do this process. As the spraying of flux and the soldering will all be automatically done, it's more accurate and higher output. The wave soldering machine has conveyors to carry the assembled PCB to go through the flux processing and send it to the wave soldering sector.