Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology

Product Details
Customization: Available
state: Liquid
pH: Neutral
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  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
  • Lead Free Silver Tin Solder Paste 500g for Surface Mount Technology
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Basic Info.

Model NO.
Lead free solder paste
Melting Point
<200℃
Chemical Composition
Sn-Bi
Function
Make the Liquid Solder Flow
Application
SMT
Manufacturing Method
Smelting
Alloy
Lead Free
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sac305 Sn96.5AG3.0cu0.5
Alloy 3
Sac0307 Sn99AG0.3cu0.7
Alloy 4
Sn42bi58 Low Temperature
Certificate
RoHS
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application 2
for SMD Soldering
Application 3
for Surface Mount Technology SMT
Transport Package
Foam Box
Specification
100g to 1000g
Trademark
XF Solder
Origin
China
HS Code
3810100000
Production Capacity
30tons/Month

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg
Lead Time
10 days (1 - 30 kg)
To be negotiated ( > 30 kg)

Product Description

Lead Free Silver Tin Solder Paste 500g for Surface Amount Technology
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Lead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyLead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyLead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyLead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyIntroduction to Tin Solder Products
Tin solder is a widely used material in the electronics industry for joining electrical components. Our company offers a range of high-quality tin solder products, including solder wire, solder bar, and solder paste, to meet the diverse needs of our customers.

Solder Wire
Our solder wire is made from a high-purity tin and lead alloy, with a rosin flux core. The rosin flux is a natural, non-corrosive flux that cleans and prepares the surface to be soldered, ensuring a strong and reliable bond. Our solder wire comes in different diameters, from 0.5mm to 2.0mm, to suit various applications.

Solder Bar
Our solder bar is made from a high-purity tin and lead alloy, with a melting point of 183ºC. It is ideal for use in manual and automated soldering processes, and provides excellent wetting and flow properties. Our solder bar comes in different weights and sizes, from 100g to 1kg, to suit different soldering needs.

Solder Paste
Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our solder paste comes in different types, such as leaded and lead-free, to meet the environmental and regulatory requirements of different countries.
 
Lead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyLead Free Silver Tin Solder Paste 500g for Surface Mount TechnologyLead Free Silver Tin Solder Paste 500g for Surface Mount Technology

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