Lead-Free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow Soldering

• state: Liquid
• pH: Neutral
• Type: Solder Paste
• Melting Point: 200℃-300℃
• Chemical Composition: Sn
• Function: Make the Liquid Solder Flow
• Model NO.: Lead-free solder paste
• Application: SMT
• Manufacturing Method: Smelting
• Alloy: Lead Free
• Powder Size: Type 3: 25 to 45 Microns
• Powder Size 2: Type 4: 20 to 38 Microns
• Flux: No Clean Flux
• Alloy 2: Sac305 Sn96.5AG3.0cu0.5
• Alloy 3: Sac0307 Sn99AG0.3cu0.7
• Alloy 4: Sn42bi58 Low Temperature
• Certificate: RoHS
• Packing: Jar
• Packing 2: Syringe
• Shipping: Courier / Air Freight
• Shelf Life: 6months
• Storage: 0 to 10 Degree Celsius
• Application 2: for SMD Soldering
• Application 3: for SMT Soldering
• Transport Package: Foam Box
• Specification: 100g to 1000g
• Trademark: XF Solder
• Origin: China
• HS Code: 3810100000
• Production Capacity: 30tons/Month

Product Description

Lead-free BGA Reballing Stencil Solder Ball Paste Tin Snagcu for Reflow soldering
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Applications of Lead Free Tin Bismuth Solder Paste Sn42Bi58 42 58:
Electronics and devices with Heat-Sensitive Components: Sn42Bi58 solder paste is a staple in electronics manufacturing, particularly for devices with components vulnerable to high temperatures.

How to use of Lead Free Tin Bismuth Solder Paste Sn42Bi58 42 58?
Printing: Use stencil to lay on the PCB and make sure that the opening holes of the stencil precisely sit on the solder pads. And print the low temperature solder paste onto the PCB.

Installing SMD Components: Carefully put surface mount components onto the solder paste-covered pads.

Soldering: Use reflow ovens or hot hair guns to heat the assembled PCB to melt the solder paste to solidify the solder joints.

Instruction on Storage and Using of Lead Free Tin Bismuth Solder Paste Sn42Bi58 42 58:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.

It's recommended to get the tin bismuth solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.

Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.