Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics

• Customization: Available
• state: Liquid
• pH: Neutral
• Model NO.: lead free solder paste
• Type: Solder Paste
• Melting Point: <200℃
• Chemical Composition: Sn-Bi
• Function: Make the Liquid Solder Flow
• Application: SMT
• Manufacturing Method: Smelting
• Alloy: Lead Free
• Powder Size: Type 3: 25 to 45 Microns
• Powder Size 2: Type 4: 20 to 38 Microns
• Flux: No Clean Flux
• Alloy 2: Sac305 Sn96.5AG3.0cu0.5
• Alloy 3: Sac0307 Sn99AG0.3cu0.7
• Alloy 4: Sn42bi58 Low Temperature
• Certificate: RoHS Lead Free
• Packing: Jar
• Packing 2: Syringe
• Shipping: Courier / Air Freight
• Shelf Life: 6months
• Storage: 0 to 10 Degree Celsius
• Application 2: for SMD SMT PCB Soldering
• Application 3: for Jet Printing Jetting Soldering
• Transport Package: Foam Box
• Specification: 100g to 1000g
• Trademark: XF Solder
• Origin: China
• HS Code: 3810100000
• Production Capacity: 30tons/Month
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for electronics
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Introduction to Tin Solder Products
Tin solder is a widely used material in the electronics industry for joining electrical components. Our company offers a range of high-quality tin solder products, including solder wire, solder bar, and solder paste, to meet the diverse needs of our customers.

Solder Wire
Our solder wire is made from a high-purity tin and lead alloy, with a rosin flux core. The rosin flux is a natural, non-corrosive flux that cleans and prepares the surface to be soldered, ensuring a strong and reliable bond. Our solder wire comes in different diameters, from 0.5mm to 2.0mm, to suit various applications.

Solder Bar
Our solder bar is made from a high-purity tin and lead alloy, with a melting point of 183ºC. It is ideal for use in manual and automated soldering processes, and provides excellent wetting and flow properties. Our solder bar comes in different weights and sizes, from 100g to 1kg, to suit different soldering needs.

Solder Paste
Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our solder paste comes in different types, such as leaded and lead-free, to meet the environmental and regulatory requirements of different countries.