• Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
  • Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
  • Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
  • Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
  • Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
  • Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing

Sn63pb37 63 37 Lead Tin Paste Solder for SMT Printing

Type: Flux-cored Wire
Material: Tin
Flux Containing: Containing Flux
Slag Characteristic: Alkaline
Extended Length: <10mm
Alloy: Tin Lead
Samples:
US$ 20/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Gold Member Since 2018

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
Paste Solder
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application 2
for SMT Reflow Soldering
Application 3
for Electronics Welding
Transport Package
Foam Box
Specification
100g to 1000g
Trademark
XF Solder
Origin
China
HS Code
3810100000
Production Capacity
30tons/Month

Product Description

Sn63Pb37 63 37 Lead Tin Paste Solder for SMT Printing
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Sn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSAC305 Solder
SAC305 Solder is a lead-free alloy that has been increasingly used in the electronics industry due to its excellent properties. It is a ternary eutectic alloy consisting of 96.5% tin, 3% silver, and 0.5% copper. This article will introduce the different products available in SAC305 Solder and their respective properties and applications.

Composition and Characteristics of SAC305 Solder
SAC305 Solder is a lead-free solder alloy that is highly reliable and has excellent thermal and mechanical properties. It has a melting temperature of 217°C, which is lower than traditional leaded solder, making it easier to work with. The alloy has a eutectic composition, which means that it has a lower melting point and a smaller melting range than other alloys. This makes it easier to reflow and results in better joint quality.

SAC305 Solder is also highly resistant to fatigue and creep, making it ideal for applications where high temperatures and stress levels are present. It has excellent wetting properties, allowing it to spread easily and create strong bonds with metal surfaces. The alloy also has good thermal conductivity, allowing it to dissipate heat efficiently.

Different Product Types of SAC305 Solder:
SAC305 Solder is available in different forms, including wire, bar, and paste. Each product has its own unique properties and applications.

SAC305 Solder Wire
SAC305 Solder Wire is a highly versatile product that is widely used in electronics manufacturing. It is available in different diameters, ranging from 0.5mm to 3mm. The wire is easy to use and can be cut to the desired length, making it ideal for hand soldering and rework. The wire is available in different alloys, allowing for customization based on the specific application.

SAC305 Solder Bar
SAC305 Solder Bar is a bulk product that is commonly used in wave soldering and selective soldering applications. The bar is available in different sizes, ranging from 1kg to 25kg. The bar is highly reliable and has excellent thermal and mechanical properties. It is also highly resistant to fatigue and creep, making it ideal for applications where high temperatures and stress levels are present.

SAC305 Solder Paste
SAC305 Solder Paste is a highly versatile product that is widely used in electronics manufacturing. It is a mixture of solder powder and flux, which is used to solder components to printed circuit boards (PCBs). The paste is easy to use and can be applied using a stencil or a dispenser. It is available in different particle sizes, allowing for customization based on the specific application.

Applications of SAC305 Solder:
SAC305 Solder is widely used in the electronics industry due to its excellent properties. It is used in various applications, including:

Surface Mount Technology (SMT): SAC305 Solder paste is commonly used in SMT applications due to its excellent wetting properties and low melting temperature.

Through-Hole Technology (THT): SAC305 Solder wire is commonly used in THT applications due to its excellent thermal and mechanical properties.

Wave Soldering: SAC305 Solder Bar is commonly used in wave soldering applications due to its excellent wetting properties and low melting temperature.

Selective Soldering: SAC305 Solder Bar is commonly used in selective soldering applications due to its excellent thermal and mechanical properties.
 
Sn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSn63pb37 63 37 Lead Tin Paste Solder for SMT PrintingSn63pb37 63 37 Lead Tin Paste Solder for SMT Printing
 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now