Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB

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Customization: Available
state: Liquid
pH: Neutral
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  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
  • Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
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Basic Info.

Model NO.
Low Temperature Solder Paste
Type
Resin
Melting Point
<200℃
Chemical Composition
Tin Lead
Function
Remove Oxides
Manufacturing Method
Smelting
Alloy
Tin Lead
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Storage
0 to 10 Degree Celsius
Application 2
SMD Components Soldering
Application 3
for PCB Soldering
Application 4
for Electrical Work
Transport Package
Foam Box
Specification
100g to 1000g
Trademark
XF Solder
Origin
China
HS Code
3810100000
Production Capacity
30tons/Month

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBLow Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBLow Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBLow Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBIntroduction to Tin Solder Products
Tin solder is a widely used material in the electronics industry for joining electrical components. Our company offers a range of high-quality tin solder products, including solder wire, solder bar, and solder paste, to meet the diverse needs of our customers.

Solder Wire
Our solder wire is made from a high-purity tin and lead alloy, with a rosin flux core. The rosin flux is a natural, non-corrosive flux that cleans and prepares the surface to be soldered, ensuring a strong and reliable bond. Our solder wire comes in different diameters, from 0.5mm to 2.0mm, to suit various applications.

Solder Bar
Our solder bar is made from a high-purity tin and lead alloy, with a melting point of 183ºC. It is ideal for use in manual and automated soldering processes, and provides excellent wetting and flow properties. Our solder bar comes in different weights and sizes, from 100g to 1kg, to suit different soldering needs.

Solder Paste
Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our solder paste comes in different types, such as leaded and lead-free, to meet the environmental and regulatory requirements of different countries.
 
Low Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBLow Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCBLow Temperature No-Clean SMD Solder Paste Sn42/Bi57.6/AG0.4 for PCB

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