Lead Free Rosin Soldering Flux Easy Silver Bearing Solder Paste 50g for Jetting

• state: Liquid
• pH: Neutral
• Type: Solder Paste
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Silver Bearing Solder Paste
• Melting Point: 200℃-300℃
• Chemical Composition: Sn
• Function: Make the Liquid Solder Flow
• Application: SMT
• Manufacturing Method: Smelting
• Alloy: Lead Free
• Powder Size: Type 3: 25 to 45 Microns
• Powder Size 2: Type 4: 20 to 38 Microns
• Flux: No Clean Flux
• Alloy 2: Sac305 Sn96.5AG3.0cu0.5
• Alloy 3: Sac0307 Sn99AG0.3cu0.7
• Alloy 4: Sn42bi58 Low Temperature
• Certificate: RoHS
• Packing: Jar
• Packing 2: Syringe
• Shipping: Courier / Air Freight
• Shelf Life: 6months
• Storage: 0 to 10 Degree Celsius
• Application 2: for SMD Soldering
• Application 3: for SMT Soldering
• Transport Package: Foam Box
• Specification: 100g to 1000g
• Trademark: XF Solder
• Origin: China
• HS Code: 3810100000
• Production Capacity: 30tons/Month
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

Rosin Soldering Flux Easy Silver Bearing Solder Paste 50g For Jetting
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Applications of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
This solder paste SAC305 is primarily used for electronics manufacturing by surface mount technology (SMT) and through-hole soldering. Including:

Consumer Electronics: It finds application in the production of consumer electronics such as refrigerators, smartphones, tablets, laptops, and gaming devices.

Automotive Electronics: The solder paste is suitable for soldering critical components in automotive electronics systems.

How to use the Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305?
Stencil Printing: Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).

Place SMD components: Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.

Conduct the Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.

Instruction on Storage and Using of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.

It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.

Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.